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TH58BYG2S3HBAI4

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Product Details

Part Number TH58BYG2S3HBAI4
Manufacturer Toshiba Memory America, Inc.
Description 4G SLC NAND BGA 24NM
Category Integrated Circuits (ICs)
Subcategory Memory
Lead Free Status Ro H S Status Lead free / RoHS Compliant
Technology FLASH - NAND (SLC)
Supplier Device Package 63-TFBGA (9x11)
Series Benand™
Package Case 63-VFBGA
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Memory Type Non-Volatile
Memory Size 4Gb (512M x 8)
Memory Format FLASH
Detailed Description FLASH - NAND (SLC) Memory IC 4Gb (512M x 8) 63-TFBGA (9x11)

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