DS3174+
Images are for reference only. See Product Specifications for product details.
Invent, Innovate, Integrate
Images are for reference only. See Product Specifications for product details.
| Part Number | DS3174+ |
| Manufacturer | Maxim Integrated |
| Description | IC TXRX DS3/E3 QUAD 400-BGA |
| Category | Integrated Circuits (ICs) |
| Subcategory | Interface - Telecom |
| Function | Single-Chip Transceiver |
| Includes | DS3 Framers, E3 Framers, HDLC Controller, On-Chip BERTs |
| Interface | DS3, E3 |
| Packaging | Tray |
| Package Case | 349-BBGA, CSBGA Exposed Pad |
| Mounting Type | Surface Mount |
| Current Supply | 725mA |
| Voltage Supply | 3.135 V ~ 3.465 V |
| Base Part Number | DS3174 |
| Numberof Circuits | 4 |
| Detailed Description | Telecom IC Single-Chip Transceiver 400-PBGA (27x27) |
| Operating Temperature | 0°C ~ 70°C |
| Supplier Device Package | 400-PBGA (27x27) |
| Lead Free Status Ro H S Status | Lead free / RoHS Compliant |
| Moisture Sensitivity Level M S L | 2 (1 Year) |