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Manufacturer Image
M2S060TS-1FGG676T2

Images are for reference only. See Product Specifications for product details.

Product Details

Part Number M2S060TS-1FGG676T2
Manufacturer Microsemi
Description IC FPGA SOC
Category Integrated Circuits (ICs)
Subcategory Embedded - System On Chip (SoC)
Speed 166MHz
Series Automotive, AEC-Q100, SmartFusion®2
R A M Size 64KB
Flash Size 256KB
Packaging Tray
Numberof I O 387
Package Case 676-BGA
Peripherals DDR, PCIe, SERDES
Architecture MCU, FPGA
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Core Processor ARM® Cortex®-M3
Primary Attributes FPGA - 60K Logic Modules
Detailed Description 300237
Operating Temperature -40°C ~ 125°C (TJ)
Supplier Device Package 676-FBGA (27x27)
Lead Free Status Ro H S Status Lead free / RoHS Compliant
Moisture Sensitivity Level M S L 3 (168 Hours)

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